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Motorola’s Advanced Packaging
Technologies Drive Cost-Effective and Space-Efficient Bluetooth
Solutions
LTCC Package Allows the World’s
Smallest RF Bluetooth Transceiver; Stacked Die Leads to High Performance
RF-Plus-Baseband Bluetooth
Solution
PHOENIX – May 20, 2002
– Leading edge packaging technologies are being applied by
Motorola’s (NYSE:MOT) Semiconductor Products Sector (SPS) in developing
BluetoothTM solutions that are designed to out-perform existing
single-chip Bluetooth products. The company is creating a comprehensive
Bluetooth RF transceiver in a 6mm x 7mm x 1.3mm Low Temperature Co-fired Ceramic
(LTCC) module; and a stacked die RF-plus-baseband Bluetooth solution, that
includes RF transceiver and baseband ICs. With these advancements, Motorola is
innovatively combining the best of wafer process and packaging technologies to
offer Bluetooth solutions that are optimized for cost, while minimizing the
board space for a variety of wireless
devices.
"These enhanced packaging technologies
are the latest examples of Motorola's leadership in the relentless pursuit of
higher levels of integration for miniaturization of wireless radios,” said
Behrooz Abdi, vice president and general manager of Motorola’s Radio
Products Division. “While many semiconductor suppliers are offering
partial solutions or touting single-chip CMOS ICs, their products compromise
performance in order to achieve a lower cost. Motorola’s key
differentiator is that its solutions combine ICs with discrete components to
achieve world class RF performance."
About LTCC
The compact Bluetooth RF transceiver module is being
designed to help reduce size, overall system cost, and total parts count. Using
LTCC technology enables multiple layers to be stacked in a thin ceramic
substrate, with a significant portion of complementary matching design
components embedded between the layers. Many of the passives that are normally
implemented as surface mount chip components are built as distributed elements,
and are embedded within the substrate layers, thereby reducing the number of
discrete passives in the package by 55 percent. The few remaining passives,
along with the transceiver IC, are mounted on top of the LTCC module substrate.
In addition, functional partitioning achieves optimized module size and
performance at an attractive cost.
This highly
integrated 2.4 GHz RF transceiver module is designed to provide a
comprehensive, low power Bluetooth 1.1 radio for Class 2 systems. The
module’s receiver features a low-noise amplifier, high/low image reject
mixer, complete VCO, post mixer amplifier, self-adjusting channel filter,
limiting amplifier, demodulator, and an A/D block. The transmitter function
includes a direct modulation FM transmitter controlled by a dual-port
fractional-N synthesizer and VCO, a low power amplifier (0 dBm), and a
transmit/receive control function. Low current drains of 27 mA (transmit) and 33
mA (receive), with multiple power down modes conserve power; while an integrated
electronic crystal trim provides the capability to compensate for as much as 50
ppm of crystal tolerance.
About Stacked Die
Motorola is also creating a compact stacked die assembly
technology which is expected to provide an RF and baseband Bluetooth solution in
a 7mm x 7mm x 1.6mm Ball Grid Array (BGA) package. This solution is designed to
actually stack the RF transceiver and the baseband processor ICs in one small
package, with interconnections between the two ICs and to the BGA substrate.
This configuration leverages the stacked die assembly and packaging technology
currently used in the production of memory
stacks.
Stacking these two ICs allows the use
of Motorola’s optimized wafer processes for the RF and baseband functions,
avoiding the compromises between cost and performance that occur with one-chip
solutions. This stacked die BGA configuration uses a leading edge RF
transceiver made with Motorola’s 0.35 micron RF BiCMOS process, and an
advanced 0.18 micron CMOS baseband processor.
Projected
Availability
Samples of the LTCC Bluetooth RF Transceiver module are
projected to be available in the third quarter, and production in the fourth
quarter of 2002. Stacked die BGA Bluetooth radio solution samples are expected
to be available in June, with production in the fourth quarter of
2002.
Solutions from a Leader in Bluetooth
Standards
Motorola is one of only nine
companies participating as Bluetooth Special Interest Group (SIG) promoters
– the highest membership level available. As a pioneer in many RF
technologies, including Bluetooth wireless technology, Motorola has the
experience and knowledge to drive a wireless market. With dozens of Motorolans
participating in leadership positions in various SIG standards working groups,
and over 25 qualified Bluetooth products to date, Motorola plans to continue
playing a major part in the market adoption of Bluetooth wireless
technology.
About Motorola
As the world's # 1 producer of embedded processors,
Motorola's Semiconductor Products Sector creates DigitalDNA™
system-on-chip solutions for a connected world. Our strong focus on wireless
communications and networking enables customers to develop smarter, simpler,
safer and synchronized products for the person, work team, home and automobile.
Motorola's worldwide semiconductor sales were $4.9 billion (USD) in 2001.
http://www.motorola.com/semiconductors
Motorola,
Inc. (NYSE:MOT) is a global leader in providing integrated communications
solutions and embedded electronic solutions. Sales in 2001 were $30
billion. http://www.motorola.com/
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Media Contacts - North
America:
Jeff
Gorin
Motorola
+1 (602) 952-3854
jeff.gorin@motorola.com
Bill
Schnell
Motorola
+1
(512) 895-2631 Office
+1 (512) 895-7760
FAX
b.schnell@motorola.com
Media
Contact - Asia-Pacific:
Gloria
Shiu
Motorola
+85-22-666-8237
gloria.shiu@motorola.com
Media
Contact - Europe, Middle East, Africa:
Regina
Cirmonova
Motorola
+41-22-799-1258
regina.cirmonova@motorola.com
Reader
Contact:
Mike
Kelley
Motorola
+1
(512) 895-7007 Office
+1 (512) 895-3051
FAX
RXCJ60@motorola.com
MOTOROLA,
the Stylized M Logo and all other trademarks indicated as such herein are
trademarks of Motorola, Inc. registered in the U.S. Patent and Trademark Office.
The Bluetooth trademark is owned by its proprietor and used by Motorola, Inc.
under license. All other product or service names are the property of their
respective owners. (c) 2002 Motorola, Inc. All rights
reserved.
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