Motorola Unveils Smart Baseband Solutions
for Wireless
InfrastructureReconfigurable
Compute Fabric (RCF) Device, Combined with Next-Generation Motorola DSPs, Helps
Reduce Cost and Complexity of 2.5G and 3G Baseband
ProcessingSMART NETWORKS DEVELOPER FORUM,
PARIS - June 5, 2003 - Wireless infrastructure vendors face multiple
challenges--from intense cost pressures to rapidly evolving standards to
significant R&D risks--in their quest to deliver base station platforms for
next-generation wireless networks. Motorola (NYSE:MOT) helps them meet these
challenges with its Smart Baseband Solutions, a comprehensive, system-level
baseband processing architecture designed for 2.5G and 3G base stations.
Motorola's MRC6011 Reconfigurable Compute Fabric (RCF) device and
next-generation MSC8126 multicore StarCore® digital signal processor (DSP),
in concert with Motorola wireless application software library modules, offer
the underlying silicon and software technology for Motorola's Smart Baseband
Solutions.
The MRC6011 RCF device is engineered
to provide an efficient processing solution for a wide range of computationally
intensive applications, such as baseband processing for 3G and broadband
wireless access systems. Working in tandem with Motorola's MSC8126 StarCore
DSP, the MRC6011 RCF device is designed to enable system architects to adapt
algorithms and fix bugs before and after deployment, fine-tune baseband
architecture and manage partition and load on the fly, design multi-standard
wireless platforms, and add advanced capabilities, such as adaptive antenna (AA)
and multi-user detection.
Motorola's Smart
Baseband Solutions offer the advanced RCF and DSP components, along with library
modules and development tools, required to develop scalable and programmable
baseband processing systems that accommodate multiple standards, such as
Wideband Code Division Multiple Access (WCDMA), Code Division Multiple Access
2000 (CDMA2000), Time Division-Synchronous Code Division Multiple Access
(TD-SCDMA) and Enhanced Data rates for GSM Evolution (EDGE). Smart Baseband
technology supports system-level flexibility, a consistent design environment
for the entire baseband and efficient C and assembly programming. In addition,
the technology is based on optimized processor-application mapping to increase
capacity, deliver high performance and maintain low-power dissipation per
channel.
“RCF
technology provides a programmable alternative to more costly ASIC- and
FPGA-based baseband system designs,” said Will Strauss, president of
Forward Concepts. “Today's wireless infrastructure market is undergoing a
rapid transition toward 3G technology. During this transition, base station
vendors require baseband processing solutions that will help reduce R&D and
deployment costs as well as ongoing cost of ownership. RCF is an exciting new
approach to meeting these needs and promises to play a prominent role in shaping
the future of wireless
infrastructure.”
“Motorola's Smart
Baseband Solutions are designed to provide a flexible, future-proof
reconfigurable compute fabric, enabling manufacturers to reduce the total cost
and complexity of wireless infrastructure equipment, adapt to evolving wireless
standards around the world, and speed time to market,” said David Perkins,
corporate vice president and general manager of Motorola's Networking and
Computing Systems Group. “Motorola is driving the future of
high-performance, multicore RCF and DSP technology for the benefit of our
wireless base station customers. Motorola's MRC6011 device represents a giant
step toward our goal of providing groundbreaking silicon solutions for 3G
baseband processing.”
About the
MRC6011 RCF DeviceThe MRC6011 device is
designed to provide the flexibility of a programmable DSP solution for baseband
processing while approaching the cost-effectiveness, power consumption and
processing capability of a traditional application-specific integrated circuit
(ASIC)-based solution. The MRC6011 combines six RCF cores into a homogeneous
compute node capable of operating at 250 MHz, with a 100 MHz maximum operating
frequency for off-core buses. The six-core MRC6011 device is designed to
deliver a peak performance of 24 giga multiply-accumulates per second (GMACS).
At 4-bit resolution, the device is capable of performing at 48 giga complex
correlations per second.
The MRC6011 is a
highly integrated system-on-chip (SoC) device that comprises two identical and
scalable reconfigurable compute (RC) modules. There are three identical RCF
cores per module, and each core has a powerful 16-element processing array. The
RC controller is an optimized RISC processor designed for efficient C code
compilation, and it features instruction and data caches, programmable timers
and external general-purpose output lines. Core peripherals include large
high-speed buffers, a special-purpose complex correlation unit, and a single-
and burst-transfer direct memory access (DMA)
controller.
The MRC6011 is manufactured on
low-power 0.13-micron CMOS process technology, enabling an internal logic
voltage of 1.2V and input/output voltage of 3.3V. Typical power consumption is
targeted at less than 3W. The device is offered in a 31 mm x 31 mm tape ball
grid array (TBGA) package.
About the MSC8126
DSPMotorola's MSC8126 device is planned to be
the first in a line of powerful, multicore StarCore DSPs designed to provide the
optimal performance, price and size per channel to address the programmability,
scalability and reconfigurability requirements of wireless infrastructure. An
SoC device, the MSC8126 combines four StarCore DSP cores, a turbo coprocessor, a
Viterbi coprocessor, a Universal Asynchronous Receiver/Transmitter (UART), four
time-division multiplexed (TDM) serial interfaces, 32 general-purpose timers, a
flexible system interface unit (SIU), an Ethernet interface and a 16-channel DMA
engine that handles independent data
transfers.
The MSC8126 device is the
industry’s most powerful 16-bit programmable DSP. Its four extended cores
are designed to deliver up to 6400 million multiply-accumulates per second
(MMACS) of DSP performance at 400 MHz. The four-core MSC8126 device is planned
to be available at two core speeds: 350 MHz and 400
MHz.
Supported by a robust set of development
tools, Motorola's multicore DSP solution is designed to drive exceptional cost
efficiency per voice and data channels for 3G wireless base station
applications. The MSC8126 is designed to be code-compatible with Motorola's
existing MSC81xx devices, and pin-compatible with the MSC8102 DSP. Motorola
plans to manufacture the MSC8126 on its 90 nm process technology, which will
enable the device to perform at higher clock
speeds.
About Motorola's Software Library
ModulesContinuing the tradition of offering
comprehensive solutions to its customers, Motorola plans to release a library of
application software modules for both the MRC6011 and MDC8126 devices. The
first version of the library is targeted at Universal Mobile Telecommunications
System (UMTS) applications with both chip-rate and symbol rate modules. These
C-callable modules are designed to significantly reduce development and debug
time.
A Full Range of Silicon for 3G Base
StationsIn addition to providing RCF and DSP
silicon for Smart Baseband Solutions, Motorola offers the processing
intelligence and high-power radio frequency (RF) technology required by 2.5G and
3G wireless base station platforms. Wireless infrastructure designers can rely
on Motorola as a “one-stop” supplier of programmable RCF devices,
high-performance DSPs, PowerQUICC™ communications processors,
C-Port™ network processors, PowerPC host processors, RF laterally-diffused
metal oxide semiconductor (LDMOS) devices, optimized timing solutions and
serializer/deserializer (SerDes) Gigabit Ethernet transceivers--all essential
components of base station platforms.
Smart
Baseband Silicon AvailabilitySamples of the
MRC6011 RCF device are planned for Q4 2003, and samples of the MSC8126 DSP are
planned for the first half of 2004. Samples and production quantities of
Motorola's MSC810x StareCore DSPs are available
now.
About Motorola’s Semiconductor
Products SectorAs the world's #1 producer of
embedded processors, Motorola's Semiconductor Products Sector creates
DigitalDNA™ system-on-chip solutions for a connected world. Our strong
focus on wireless communications and networking enables customers to develop
smarter, simpler, safer and synchronized products for the person, work team,
home and automobile. Motorola's worldwide semiconductor sales were $5.0 billion
(USD) in 2002. For more information please visit
www.motorola.com/semiconductorsAbout
Motorola, Inc.Motorola, Inc. (NYSE:MOT) is a
global leader in providing integrated communications and embedded electronic
solutions. Sales in 2002 were $27.3 billion. Motorola is a global corporate
citizen dedicated to ethical business practices and pioneering important
technologies that make things smarter and life better, honored traditions that
began when the company was founded 75 years ago this year. For more
information, please visit:
www.motorola.com.
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