Motorola Develops Flexible Packaging Solution for Power Electronics Applications

Motorola's Latest PQFN package saves space, enhances performance and allows many chips to be integrated into single package

Tempe, Arizona - June 30, 2003 - Designers of power electronics systems who have been searching for a solution to their high current and high power needs have found an answer. Motorola, Inc.'s (NYSE:MOT) power quad flat pack no-lead (PQFN) integrated circuit (IC) package boosts silicon performance by eliminating limitations of existing packages. The PQFN surface mount package is one of the industry's latest packages designed specifically to meet the high power dissipation requirements of automotive, industrial, marine and commercial applications.

"In most semiconductor technologies, the silicon is advancing at a rate that is outpacing the capability of the industry's available packages," said Clem Brown, manager of power packaging development at Motorola's Semiconductor Products Sector. "The PQFN is capable of closing this gap, which allows our customers to realize the full potential of their designs. We've designed a packaging platform that is flexible enough to accommodate almost any kind of design and integrate up to four die in the same package - all in an amazingly small finger-tip-size package."

The PQFN solution uses a minimum amount of board space while providing excellent electrical and thermal characteristics. The use of a 20-mil-thick copper lead frame and heavy gauge aluminum bond wires help to efficiently transfer heat out of the package while providing low electrical on-resistance. Conduction is the primary mode of heat transfer that moves the generated heat away from the die surface and out of the package through exposed heat sinks on the bottom surface of the PQFN.

Advantages of the PQFN Package
In addition, the PQFN provides many advantages over existing quad flat pack no-lead packages and other existing power IC packages, including:

- Leadless package replaces existing larger, axial leaded packages
- Proven solder joint reliability when surface mounted to PCB boards
- Cost effective solution for multi-chip power products
- Environmentally preferred packaging materials
- MAP process allows electrical and physical flag isolation of multiple die
- Design and process flexibility in a common surface mount form factor
- Superior thermal performance with 20-mil-thick copper lead frame
- Very low contribution to electrical on-resistance

Flexibility for Variety of Products and Applications
Motorola is currently working on more than 20 configurations of the PQFN package with lead counts ranging from 16 to 35. Custom versions of the PQFN are expected to be available for unique applications or specific customers. Motorola has applied for JEDEC registration for its line of standard PQFN-S platform products, which range in size from 5mm to 12mm.

Motorola is designing a variety of products that are expected to benefit from the PQFN package. These components are targeted at automotive, commercial, marine, industrial and RF applications. The first product launched is the MC33982 self-protected silicon switch that recently won the EDN Innovation of the Year Award in the power IC category. (April 23, 2003 EDN, www.ednmag.com/) This 2 milliohm high-side power switch is housed in a 12 x 12 mm PQFN.

"The ability to help designers of power electronics systems better manage power distribution, reduce board space and increase system reliability can be credited to the PQFN package," said Russell Shumway, manufacturing program manager with Motorola's Analog Products Division.

Motorola's package development lab has built samples of the PQFN packages to optimize the design and processing of PQFN-products. The package is expected to be qualified for commercial and industrial applications by the end of second quarter, and for automotive applications by the end of the year. The PQFN package is expected to reach volume production by the end of the year.

Graphics for this release are available at
http://www.motorola.com/mediacenter/graphics/detail/0,1101,825,00.html
http://www.motorola.com/mediacenter/graphics/detail/0,1101,823,00.html
http://www.motorola.com/mediacenter/graphics/detail/0,1101,822,00.html

About Motorola, Inc.'s Semiconductor Products Sector
As the world's #1 producer of embedded processors, Motorola's Semiconductor Products Sector creates DigitalDNA™ system-on-chip solutions for a connected world. Our strong focus on wireless communications and networking enables customers to develop smarter, simpler, safer and synchronized products for the person, work team, home and automobile. Motorola's worldwide semiconductor sales were $4.8 billion (USD) in 2002. For more information please visit: www.motorola.com/semiconductors

About Motorola, Inc.
Motorola, Inc. (NYSE:MOT) is a global leader in providing integrated communications and embedded electronic solutions. Sales in 2002 were $26.7 billion. Motorola is a global corporate citizen dedicated to ethical business practices and pioneering important technologies that make things smarter and life better for people, honored traditions that began when the company was founded 75 years ago this year. For more information, please visit: www.motorola.com

# # #

Media Contacts

North America:
Glaston Ford
+1 (512) 895-6466
glaston@motorola.com

Asia-Pacific:
Gloria Shiu
+85-22-666-8237
gloria.shiu@motorola.com

Europe, Middle East, Africa:
Regina Cirmonova
+41-22 -799-1258
regina.cirmonova@motorola.com


MOTOROLA and the Stylized M Logo are registered in the US Patent & Trademark Office. All other product or service names are the property of their respective owners. © 2003 Motorola, Inc.