Motorola Develops High Power Plastic Packages Capable of Continuous Operation at 200 Degree C Junction Temperature

Breakthrough Offers Significant Benefits in Cost-effectiveness and Device Performance

EMBEDDED SYSTEMS CONFERENCE, Boston - 15 September 2003 -- Motorola (NYSE-MOT) introduces the first commercially available high frequency RF plastic package capable of operating a junction temperature of up to 200 degree Celsius. The latest addition to Motorola's RF power plastic packaging portfolio continues a string of industry firsts, which began with the introduction of the first RF power plastic package in 1996. Now, with the qualification of the MRF9045M, Motorola has set a new industry standard for power plastic packaging capable of operating at 200 degree C device junction temperature. This operating temperature, once only used for high-reliability packages in industrial/military applications or metal-ceramic packages, has now been achieved in plastic packaging.

Immediate advantages of this packaging breakthrough include:
- Higher power capability in the same footprint
- Alternative, cost-effective solutions to metal-ceramic packaging
- Surface-mount technology (SMT) solutions for high power RF devices
- Lower system thermal management costs
- Easier manufacturing for OEMs by enabling automated assembly of RF power amplifiers
- Increased thermal margin over standard plastic packaging

Historically, the wireless infrastructure market for high power RF applications has relied on metal-ceramic package technology. For years metal-ceramic provided a robust solution for high-performance, extreme-condition applications. However, rapid growth of the global wireless market has created the need for higher volume, cost-effective solutions that metal-ceramic packaging cannot offer.

"We listened to our customers' requests for higher performance packaging that offers the flexibility to reduce overall system costs in the areas of manufacturing and thermal management," said Lynelle McKay, vice president and general manager of Motorola's RF & DSP Infrastructure Division.

"Along with the manufacturing cost benefits, this breakthrough maintains the RF performance our customers have come to expect."

By extending the operating temperature of the RF plastic package to 200 degree C, Motorola is enabling designers to use the higher performance capabilities of RF plastic devices without increasing thermal management costs. It also gives customers a choice of solutions to match their manufacturing requirements. Additionally, this innovation makes possible the use of Motorola components in compact locations such as masthead amplifiers where additional cooling may be minimal or non-existent.

This technology will be applied to a portfolio of high power, high frequency products that will also be designed to meet a minimum of JEDEC MSL 3 260 degree C reflow capability and industry requirements for lead-free terminals.

About Motorola, Inc.'s Semiconductor Products Sector
As the world's #1 producer of embedded processors, Motorola's Semiconductor Products Sector creates DigitalDNA(tm) system-on-chip solutions for a connected world. Our strong focus on wireless communications and networking enables customers to develop smarter, simpler, safer and synchronized products for the person, work team, home and automobile. Motorola's worldwide semiconductor sales were $5.0 billion (USD) in 2002. For more information please visit www.motorola.com/semiconductors.

About Motorola, Inc.
Motorola, Inc. (NYSE:MOT) is a global leader in providing integrated communications and embedded electronic solutions. Sales in 2002 were $27.3 billion. Motorola is a global corporate citizen dedicated to ethical business practices and pioneering important technologies that make things smarter and life better, honored traditions that began when the company was founded 75 years ago this year. For more information, please visit www.motorola.com.

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