Product Testing Services

Environmental Stress and Reliability

Ever wonder what it's like to go from the Sahara Desert to the Arctic in about 5 seconds?  This is the essence of Thermal Shock testing.  It is similar to thermal cycling, but more severe and may involve different failure mechanisms.  It can use air or liquid as a medium to transfer thermal energy.  Air-to-air systems are more common for general product testing as they are able to handle larger devices and are easier to maintain.  Liquid-to-liquid systems are able to transfer greater thermal energy at higher rates and are used for some component-level stress tests.

Air-to-air Thermal Shock Testing

Air-to-air Thermal Shock Testing

Air-to-air thermal shock testing employs a very high rate of temperature change, typically 30 degrees C per minute or higher.  To do this with a single chamber would require either a very high performance refrigeration system or a direct coolant like liquid nitrogen (LN2), both of which are very expensive to purchase and maintain.  To avoid these problems, typically a two or three chamber system is used.  In the case of the two-chamber design, one chamber is hot, the other is cold, and they are stacked on top of each other (can also be side by side).  Three chamber systems can have a hot, room temperature, and cold arrangement, or a hot, cold, hot design permitting two different tests to be run simultaneously provided they share the same cold temperature.  For all cases, a carriage is used to move the product under test between the boxes.  This transition is typically done in as little time as 5 seconds.  Of note is that thermal shock is designed to "relieve" stress inherent in incorrectly designed or manufactured components as opposed to the fatiguing mechanisms at work in thermal cycling stress.

Liquid-to-liquid systems employ a two-vat system and a mechanized basket arrangement to move product between the hot and cold sides of the equipment.  The baskets are typically small, perhaps large enough to hold a number of small printed circuit boards.  Other than the difference in size and thermal medium, the process works basically the same.

What are the variables for these tests?

  • Hot box temperature

  • Cold box temperature

  • Soak time in the hot box

  • Soak time in the cold box

  • Transition time (for some equipment, this cannot be modified).  Usually specified as a maximum time permitted to move the product from one box to the other.

  • Number of cycles (a cycle is defined as the combination of one hot and one cold soak)

Soak times range from as little as a few minutes to hours.  From the standpoint of optimizing the test, the only purpose of the soak is to ensure that the device under test has stabilized at the box temp.  Almost all of the stress occurs during the rapid transition as opposed to being attributable to the storage effects at the high or low temperature.  For this reason it is best to characterize the device by instrumenting the component on the device that has the highest thermal mass (that which will take the longest time to thermally stabilize).  Record the times required after both a hot and cold transition for stabilization noting that the two may be somewhat different.  Add a small margin of a few minutes to account for variation and use those times for your hot and cold soaks.  A significant amount of time can be cut from your testing resulting in significant savings to your test budget.

Number of cycles depends on the device.  It is best to try and draw some analogies to the product's expected field usage.  If this is not clear, look at some of the standard specs.  We typically see cycles varying from as little as 1 to as many as 200.

 

Test Specification Template (Thermal Shock Testing)

Top

Expert Product Testing Services
To find out more about how Motorola can help you, please contact us
at (770)338-3795,testservices@motorola.com or complete ourinquiry form.