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Jad Rasul, Bill Olson, “Flip Chip on Paper Assembly Utilizing Anisotropic Conductive Adhesive,” Proceedings of the IEEE 52nd Electronic Components and Technology Conference (ECTC), San Diego, CA, May 2002
Jad S. Rasul, William Olson, “Anisotropically Conductive Adhesive for Flip Chip on Paper Assembly,” Proceedings of the International Microelectronics and Packaging Society (IMAPS) 35th. International Symposium on Microelectronics, Denver, CO, Sept. 2002
Bill Olson, “Green Supply Chain and Ecodesign,” International Workshop on Greening Supply Chains and EcoDesign, Taipei, Taiwan Republic of China, October, 2004
Bill Olson, Bill Hoffman, “Test Methods and Compliance with Product Substance Bans,” Proceedings of the Surface Mount Technology Association (SMTA) International Conference, Chicago, IL, Sept. 2005
Bill Olson, Jim Liu, “Six Sigma R&D and the Supply Chain,” Proceedings of the Surface Mount Technology Association (SMTA) International Conference, Chicago, IL, Sept. 2005
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